H5DU5162EFR-J3I

Produktübersicht

IC Picture

Bilder dienen nur der Illustration

Hersteller-Nummer H5DU5162EFR-J3I
Hersteller SK HYNIX
Produktkategorie DDR1 SDRAM
IC-Code 32MX16 DDR1

Produktbeschreibung

Gehäuse FBGA
Verpackung TRAY
RoHS RoHS
Spannungsversorgung 2.5 V
Betriebstemperatur -40 C~+85 C
Geschwindigkeit 166 MHZ
Standard Stückzahl
Abmessungen Karton
Number Of Words 32M
Bit Organization x16
Density 512M
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 6th
No Of Banks 4 banks
Product Family DRAM
Shipping Method tray

FFFE (Form, Fit & Functional Equivalents)

Teilenummer Gehäuse Spannungsversorgung Geschwindigkeit Betriebstemperatur
IS43R16320F-6BI FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638F-HIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638F-HIB3000 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638F-HIB3T000 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638G-HIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638G-HIB3TCV FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638J-BCIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638J-BIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638J-BPB3 FBGA 2.5 V 166 MHZ -40 C~+85 C