H5DU5162EFR-J3I

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No H5DU5162EFR-J3I
Brand SK HYNIX
Item DDR1 SDRAM
Part No 32MX16 DDR1

Product Details

Package FBGA
Outpack TRAY
RoHS RoHS
Voltage 2.5 V
Temperature -40 C~+85 C
Speed 166 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 32M
Bit Organization x16
Density 512M
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 6th
No Of Banks 4 banks
Product Family DRAM
Shipping Method tray

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
IS43R16320F-6BI FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638F-HIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638F-HIB3000 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638F-HIB3T000 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638G-HIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638G-HIB3TCV FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638J-BCIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638J-BIB3 FBGA 2.5 V 166 MHZ -40 C~+85 C
K4H511638J-BPB3 FBGA 2.5 V 166 MHZ -40 C~+85 C