K9F1G08ROBJIBO
Produktübersicht
Bilder dienen nur der Illustration
| Hersteller-Nummer | K9F1G08ROBJIBO |
| Hersteller | SAMSUNG |
| Produktkategorie | FLASH-NAND |
| IC-Code | 128MX8 NAND SLC |
Produktbeschreibung
| Gehäuse | FBGA-63 |
| Verpackung | TRAY |
| RoHS | RoHS |
| Spannungsversorgung | 2.7V-3.6V |
| Betriebstemperatur | -40 C~+85 C |
| Geschwindigkeit | 25 NS |
| Standard Stückzahl | 1280 |
| Abmessungen Karton | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Generation | 3rd Generation |
| Pre Prog Version | Serial |
| Classification | SLC Normal |
| Cust Bad Block | Include Bad Block |
Verfügbare Angebote
| Teilenummer | Menge | Datecode | |
|---|---|---|---|
| K9F1G08ROBJIBO | 5.700 | Anfrage senden | |
| K9F1G08ROBJIBO | 12.500 | Anfrage senden | |
| K9F1G08ROBJIBO | 12.177 | Anfrage senden | |
| K9F1G08ROBJIBO | 1.120 | 9 | Anfrage senden |
| K9F1G08ROBJIBO | 1.046 | 2009+ | Anfrage senden |
| K9F1G08ROBJIBO | 6.783 | Anfrage senden | |
| K9F1G08ROBJIBO | 6.783 | 200631+ | Anfrage senden |
| K9F1G08ROBJIBO | 631 | Anfrage senden | |
| K9F1G08ROBJIBO | 1.010 | 201239 | Anfrage senden |
| K9F1G08ROBJIBO | 12.800 | 2010+ | Anfrage senden |
FFFE (Form, Fit & Functional Equivalents)
| Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
|---|---|---|---|---|
| EN27LN1G08-25CEIP | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| F59L1G81MA -25BIG2Y | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2BFR-BIR | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| H27U1G8F2CFR-BI | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G081-BLI-TR | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML01G084-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34ML08G168-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
| IS34MLI01G084-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |