K9F1G08ROBJIBO
产品概述
图片仅供参考
| 制造商IC编号 | K9F1G08ROBJIBO |
| 厂牌 | SAMSUNG/三星 |
| IC 类别 | FLASH-NAND |
| IC代码 | 128MX8 NAND SLC |
产品详情
| 脚位/封装 | FBGA-63 |
| 外包装 | TRAY |
| 无铅/环保 | 无铅/环保 |
| 电压(伏) | 1.65V~1.95V |
| 温度规格 | -40 C~+85 C |
| 速度 | 25 NS |
| 标准包装数量 | 1280 |
| 标准外箱 | |
| Number Of Words | 128M |
| Bit Organization | x8 |
| Density | 1G |
| Pre Prog Version | Serial |
| Generation | 3rd Generation |
| Classification | SLC Normal |
| Cust Bad Block | Include Bad Block |
供应链有货
| IC 编号 | 数量 | 生产年份 | |
|---|---|---|---|
| K9F1G08ROBJIBO | 5,700 | 索取报价 | |
| K9F1G08ROBJIBO | 12,500 | 索取报价 | |
| K9F1G08ROBJIBO | 12,177 | 索取报价 | |
| K9F1G08ROBJIBO | 1,120 | 9 | 索取报价 |
| K9F1G08ROBJIBO | 1,046 | 2009+ | 索取报价 |
| K9F1G08ROBJIBO | 6,783 | 索取报价 | |
| K9F1G08ROBJIBO | 6,783 | 200631+ | 索取报价 |
| K9F1G08ROBJIBO | 631 | 索取报价 | |
| K9F1G08ROBJIBO | 1,010 | 201239 | 索取报价 |
| K9F1G08ROBJIBO | 12,800 | 2010+ | 索取报价 |
FFFE/互通料号 (形式，腳位和功能对等)
| IC 编号 | 脚位/封装 | 电压(伏) | 速度 | 温度规格 |
|---|---|---|---|---|
| H27S1G8F2BFR-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2BFR-BI NBSP | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2BFR-BIR | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2CFE-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2CFR-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| IS35MW01G084-BLA1 | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| K9F1G08R08-JIBO | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A-/B-JIB | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A-JIB0000 | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A/B-JIB0 | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |