Bilder dienen nur der Illustration
Hersteller-Nummer | W29N08GZBIBA |
Hersteller | WINBOND |
Produktkategorie | FLASH-NAND |
IC-Code | 1GX8 NAND SLC |
Gehäuse | VFBGA-63 |
Verpackung | |
RoHS | RoHS |
Spannungsversorgung | 2.7V~3.6V |
Betriebstemperatur | -40 C~+85 C |
Geschwindigkeit | 25 NS |
Standard Stückzahl | |
Abmessungen Karton | |
Bit Organization | x8 |
Option Information | OTP command supported(contact winbond for option information) |
Product Family | ONFI compatible NAND flash memory |
Reserved | general product |
Company Prefix | winbond |
Product Version | G |
Supply Voltage Bus Width | 1.7~1.95V and X8 device |
Teilenummer | Menge | Datecode | |
---|---|---|---|
W29N08GZBIBA | 160 | 201934 | Anfrage senden |
W29N08GZBIBA | 160 | W2Y | Anfrage senden |
W29N08GZBIBA | 1.600 | W2Y | Anfrage senden |
Teilenummer | Gehäuse | Spannungsversorgung | Geschwindigkeit | Betriebstemperatur |
---|---|---|---|---|
IS34ML08G088-BLI | VFBGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
K9F8G08UOAJIBO | FBGA-63 | 2.7V-3.6V | 25 NS | -40 C~+85 C |
S34ML08G101BHA000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI00 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI000 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI003 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI003 63-BGA | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G101BHI003-63. | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G201BHA0 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |
S34ML08G201BHA003 | BGA-63 | 3.3 V | 25 NS | -40 C~+85 C |