| MTC20146TQC |
ALCATEL |
ASIC |
443
|
ASIC / MTC20146 / PQFP / Leaded |
| MD5832-D256-V3Q18-X-P/Y |
SANDISK |
FLASH-DISK ON CHIP |
42,000
|
FLASH-DISK ON CHIP / 32MB DOC / FBGA-85 / 55 NS / -40 C~+125 C / RoHS / 3.3 V / TRAY / 1000 pcs 1.22 kg 37*17*5 cm |
| K4G163222AQC-70 |
SAMSUNG |
SGRAM |
661
|
SGRAM / 512KX32 SG / TQFP / 0 C~+85 C / Leaded / 3.3 V |
| HM1811/24105-12 |
CONEXANT |
CHIPSET |
500
|
CHIPSET / HM1811 / MQFP / Leaded / TAPE ON REEL / 500 pcs |
| MK2771-02STR |
ICST/INTEGRATED-CIRCUIT |
SYNTHESIZERS |
1,000
|
SYNTHESIZERS / MK2771 / SOIC / Leaded / TAPE ON REEL / 1000 pcs |
| M13S128168A-5TG |
ESMT/EMP |
DDR1 SDRAM |
82,085
|
DDR1 SDRAM / 8MX16 DDR1 / TSOP2(66) / 200 MHZ / 0 C~+85 C / RoHS / 2.5 V / TRAY / 1080 pcs 2.1 kg 36*16*9 cm |
| EC2SM-15.000MTR |
ECLIPTEK |
CRYSTAL |
12,000
|
CRYSTAL / EC2SM / HC49-UP / Leaded / TAPE ON REEL / 1000 pcs |
| EC2SM-10.111MTR |
ECLIPTEK |
CRYSTAL |
2,000
|
CRYSTAL / EC2SM / DIP / Leaded / TAPE ON REEL / 1000 pcs |
| K4F151612D-TC60T00 |
SAMSUNG |
DRAM |
162,175
|
DRAM / 1MX16 FP / TSOP2(44/50) / 60 NS / 0 C~+85 C / Leaded / 3.3 V / TAPE ON REEL / EOL / 1000 pcs 1.46 kg 36*34*7 cm |
| MS06-D9SD8-B3 |
SANDISK |
MCP |
726
|
MCP / 64MF+32MSE / FBGA / Leaded |
| MS11-D9P7-B1 |
SANDISK |
MCP |
1,280
|
MCP / 512MF+128MPS / FBGA / Leaded / TRAY / 850 pcs 1.2 kg 36*16*5 cm |
| MD3831-D16-V3Q18-X |
SANDISK |
FLASH-DISK ON CHIP |
4,650
|
FLASH-DISK ON CHIP / 16MB DOC / FBGA / Leaded / TAPE ON REEL / 1000 pcs 0.9 kg 35*35*5 cm |
| MS12-D9N7P6-B1 |
SANDISK |
MCP |
760
|
MCP / 512MF+128MNF+64 / FBGA / Leaded / TRAY / 950 pcs |
| MD3331-D64-V3-X-P |
SANDISK |
FLASH-DISK ON CHIP |
4,024
|
FLASH-DISK ON CHIP / 64MB DOC / FBGA / -40 C~+125 C / RoHS / TAPE ON REEL / 1000 pcs |
| MS06-D9SD8-B3-P |
SANDISK |
MCP |
1,600
|
MCP / 64MF+32MSE / FBGA / RoHS / TAPE ON REEL / 1000 pcs 0.9 kg 35*35*5 cm |
| AT28C64B-25JI |
MICROCHIP |
EEPROM |
234
|
EEPROM / 28C64 / PLCC-32 / 250 NS / -40 C~+85 C / Leaded / 5.0 V |
| AT28LV256-25JI |
MICROCHIP |
EEPROM |
462
|
EEPROM / 28LV256 / PLCC / Leaded / TUBE |
| AT28BV64B-25JC |
MICROCHIP |
EEPROM |
891
|
EEPROM / 28BV64 / PLCC / 0 C~+85 C / Leaded / TUBE / EOL |
| XC7336-PC44ACK |
AMD XILINX |
FPGA |
113
|
FPGA / XC7336 / PLCC-44 / Leaded |
| HM628512CLP-5SL |
RENESAS |
SRAM |
2
|
SRAM / 512KX8 SRAM / DIP-32 / 55 NS / 0 C~+70 C / Leaded / 5.0 V / TUBE / EOL |
| HYB314400BJ-60 |
INFINEON+CYPRESS |
DRAM |
29,481
|
DRAM / 1MX4 FP / SOJ-20/26 / 60 NS / 0 C~+70 C / Leaded / TAPE ON REEL / 1500 pcs 1.99 kg 35*35*4 cm |
| MD2534-D2G-X-P |
SANDISK |
FLASH-DISK ON CHIP |
5
|
FLASH-DISK ON CHIP / 256MB DOC / BGA-G / -40 C~+125 C / RoHS / TRAY / EOL |
| MD5832-D256-V3Q18-X-P |
SANDISK |
FLASH-DISK ON CHIP |
54,367
|
FLASH-DISK ON CHIP / 32MB DOC / FBGA-85 / 55 NS / -40 C~+85 C / RoHS / 3.3 V / TAPE ON REEL / 1000 pcs 0.82 kg 35*35*5 cm |
| MB86832-100PFV-G |
CYPRESS |
MCU |
1,085
|
MCU / MB86832 / SQFP / Leaded / TRAY / 120 pcs 1.5 kg 28*18*6 cm |
| NS32FX164AV-25 |
NATIONAL/NSC |
PROCESSOR |
226
|
PROCESSOR / 32FX164 / Leaded / TUBE / 226 pcs 1.59 kg |