H57V2562GFR-70C
Product Details
| Package | FBGA |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | normal power & commercial temp |
| Speed | 143MHz 3-3-3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | lead & halogen free |
| Hynix Memory | H |
| No Of Banks | 4 banks |
| Die Generation | 8th |
| Product Family | DRAM |
| Product Mode | SDR |
| Shipping Method | tray |