H57V2562GTR-75J
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | -40 C~+85 C |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | lead & halogen free |
| Hynix Memory | H |
| No Of Banks | 4 banks |
| Die Generation | 8th |
| Product Family | DRAM |
| Product Mode | SDR |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| V54C3256164VJI7 | TSOP2 | 3.3 V | 133 MHZ | -40 C~+85 C |
| W982516BH75I | TSOP2 | 3.3 V | 133 MHZ | -40 C~+85 C |
| W982516CH-75I | TSOP2 | 3.3 V | 133 MHZ | -40 C~+85 C |