H5TQ2G63GFR-TEI

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No H5TQ2G63GFR-TEI
Brand SK HYNIX
Item DDR3 SDRAM
Part No 128MX16 DDR3
Alternate Names H5TQ2G63GFR-TEIR

Product Details

Package FBGA-96
Outpack TRAY
RoHS RoHS
Voltage 1.5 V
Temperature -40 C~+95 C
Speed 2133 MBPS
Std. Pack Qty
Std. Carton
Number Of Words 128M
Bit Organization x16
Density 2G
Operating Temperature industrial temperature(-40°C~85°C) & normal power
Package Material lead & halogen free(ROHS compliant)
Hynix Memory H
Die Generation 8th
No Of Banks 8 banks
Product Family DRAM
Shipping Method tray

Available Offers

Description Qty Datecode
H5TQ2G63GFR-TEI 11,200 Get Quote
H5TQ2G63GFR-TEIR 6,000 Get Quote
H5TQ2G63GFR-TEI 1,791 14+ Get Quote
H5TQ2G63GFR-TEI 1,600 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H5TQ2G63FFR-TEI FBGA-96 1.5 V 2133 MBPS -40 C~+95 C
IS43TR16128B-093NBA1 FBGA-96 1.5 V 2133 MBPS -40 C~+95 C
IS43TR16128B-093NBLI-TR FBGA-96 1.5 V 2133 MBPS -40 C~+95 C
IS43TR16128C-093NBLI-TR FBGA-96 1.5 V 2133 MBPS -40 C~+95 C
IS43TR16128D-093NBA1 FBGA-96 1.5 V 2133 MBPS -40 C~+95 C
IS43TR16128DL-093NBA1 FBGA-96 1.5 V 2133 MBPS -40 C~+95 C
NT5CB128M16JR-FLI TFBGA-96 1.5 V 2133 MBPS -40 C~+95 C