HY57V161610DT-8
Product Details
| Package | TSOP2(50) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 125 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 2 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EM636165FE-8 | TSOP2(50) | 3.3 V | 125MHZ | 0 C~+70 C |
| EM636165TS-8 | TSOP2(50) | 3.3 V | 125MHZ | 0 C~+70 C |
| EM636165TS-8(TSOP50) | TSOP2(50) | 3.3 V | 125MHZ | 0 C~+70 C |
| HY57V161 610DTC-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V16160BTC-7-6-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V16160BTC-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V16160DTC-7/-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V16160DTC-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V16160DTS-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V16160ET-8 | TSOP2(50) | 3.3 V | 125 MHZ | 0 C~+70 C |