| Package | TSOP2(50) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 200 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 2 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V161610DTC-5 | 8,400 | 10+ | Get Quote |
| HY57V161610DTC-5 | 10,000 | 200543+ | Get Quote |
| HY57V161610DTC-5 | 1,500 | 10+ | Get Quote |
| HY57V161610DTC-5 | 2,544 | 10+ | Get Quote |
| HY57V161610DTC-5 | 1,000 | 2005+ | Get Quote |
| HY57V161610DTC-5 | 100 | 2005+ | Get Quote |
| HY57V161610DTC-5 | 5,000 | 02 | Get Quote |
| HY57V161610DTC-5 | 5,641 | 02 | Get Quote |
| HY57V161610DTC-5 | 5,000 | Get Quote | |
| HY57V161610DTC-5 | 1,800 | Get Quote |
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EM636165TS-5 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| EM636165TS5G | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V16160ET-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610DTC-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610DTC-75 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ET-5 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ET-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ETC-55 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ETC-75 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V161610ETP-5 | TSOP2(50) | 3.3 V | 200 MHZ | 0 C~+70 C |