HY57V161610ET-6
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | normal |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 2 banks |
| Die Generation | 6th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V161610ET6 | 500 | 4 | Get Quote |
| HY57V161610ET6 | 8,000 | 2009+ | Get Quote |
| HY57V161610ET6 | 0 | Get Quote | |
| HY57V161610ET6 | 8,000 | Get Quote | |
| HY57V161610ET6 | 4,149 | Get Quote | |
| HY57V161610ET6 | 2,339 | Get Quote | |
| HY57V161610ET6 | 1 | 06+ | Get Quote |
| HY57V161610ET6 | 2,339 | 2004 | Get Quote |
| HY57V161610ET6 | 4,000 | Get Quote | |
| HY57V161610ET6 | 5,000 | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| AS4C1M16S-6TCN | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| AS4C1M16S-6TCNTR | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| EDS1616AGTA-6BE | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V16160DTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V16160ET-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V16160ETP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V16160TC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V161610BCT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V161610BTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V161610CT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |