HY57V161610ETP-6
Product Details
| Package | TSOP2(50) |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 6th Gen. |
| No Of Banks | 2 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V161610ETP-6 | 1,920 | Get Quote | |
| HY57V161610ETP-6 | 460 | Get Quote | |
| HY57V161610ETP-6 | 800 | 4 | Get Quote |
| HY57V161610ETP-6 | 8,000 | 2009+ | Get Quote |
| HY57V161610ETP-6 | 10,000 | 2008+ | Get Quote |
| HY57V161610ETP-6 | 460 | 2004 | Get Quote |
| HY57V161610ETP-6969PCS | 969 | 2006+ | Get Quote |
| HY57V161610ETP-6969PCS | 969 | 06+ | Get Quote |
| HY57V161610ETP-6 | 5,000 | 2009+ | Get Quote |
| HY57V161610ETP-6 | 1,000 | 2007+ | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EM6361651M16 | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM6361655TS-6G | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TG-6G | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6 | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6 1X16-6 | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6G | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6G ETRON | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6G NBSP | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6G PB-FREE | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |
| EM636165TS-6G,1MX16,TSOP-50 | TSOP2(50) | 3.3 V | 166 MHZ | 0 C~+70 C |