| Package | TSOP2(50) |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 1st Gen. |
| No Of Banks | 2 banks |
| Shipping Method | tray |
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V16160DTC-H | TSOP2(50) | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V161610DT-10(4K) | TSOP2(50) | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V161610DTC-8/BMK | TSOP2(50) | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V161610ET-H | TSOP2(50) | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V161610ETP-H | TSOP2(50) | 3.3 V | 133 MHZ | 0 C~+70 C |