| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 143 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 4 banks |
| Shipping Method | tray |
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| AS4C1M16S-7TCN | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C1M16S-7TCN ALL | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C1M16S-7TCNTR | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| AS4C1M16S-7TCNTR ALL | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161010DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V16110DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161612DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161616ETP-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V16161DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |
| HY57V161620DTC-7 | TSOP2 | 3.3 V | 143 MHZ | 0 C~+70 C |