| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V161620HGT-6 | 100,000+ | Get Quote |
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| AS4C1M16S-6TCN | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| AS4C1M16S-6TCNTR | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| EDS1616AGTA-6BE | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V161614BTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V161616DTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V161620ETP-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W981616AH6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W981616BH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W981616CH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| W981616DH-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |