| Package | TSOP |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | commercial(0°C~70°C) |
| Speed | 166 MHz |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 1M |
| Bit Organization | x16 |
| Density | 16M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 6th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY57V161622ET60 | 20,000 | 2004+ | Get Quote |