Package | TSOP2 |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 8M |
Bit Organization | x16 |
Density | 128M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | low power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V281620AT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620AT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620AT-K | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620BLT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620BT-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620BT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620BT-K | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620BTC-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620CT-7 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V281620CT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |