HY57V283220DT-H
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 4M |
| Bit Organization | x32 |
| Density | 128M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 5th Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V283220CT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V283220HGT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W9812G2DH-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| W9812G2GH-75 | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |