HY57V28820HCT-6
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x8 |
| Density | 128M |
| Package Material | normal |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 4 banks |
| Die Generation | 4th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V28820AT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820CT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820HCT-H #160 #16 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V28820HGT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |