HY57V28820HGT-75
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 200 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x8 |
| Density | 128M |
| Package Material | normal |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 4 banks |
| Die Generation | 5th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V28820ALT-P75 | TSOP2 | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V28820AT-75 | TSOP2 | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V28820HCT-5 | TSOP2 | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V28820HCT-55 | TSOP2 | 3.3 V | 200 MHZ | 0 C~+70 C |
| HY57V28820HCT-75 | TSOP2 | 3.3 V | 200 MHZ | 0 C~+70 C |