Package | TSOP2(54) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 16M |
Bit Organization | x16 |
Density | 256M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 2nd Gen. |
Power Consumption | normal power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
EM63A165TS | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TS-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TS-6/7 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TS-6G | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TS-6G NBSP | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TS-6GTS | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TS-6GTS,TSOP54 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TSB-6G | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
EM63A165TSC-6G | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |
HY57V561620BT-6 | TSOP2(54) | 3.3 V | 166 MHZ | 0 C~+70 C |