HY57V561620HT-8
Product Details
| Package | TSOP2(54) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 125 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x16 |
| Density | 256M |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 1st Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V561620CTH #12288 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V561620CTPH #12288 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V561620FLTP-HI-C/08 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V561620HGT-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V561620T-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |