HY57V56420CTP-H
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 133 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 64M |
| Bit Organization | x4 |
| Density | 256M |
| Package Material | Lead free |
| Interface | LVTTL |
| Hynix Memory | HY |
| No Of Banks | 4 banks |
| Die Generation | 4th Gen. |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V56420BT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V56420CT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V56420HDT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V56420HT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V56420LT-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |
| HY57V56420T-H | TSOP2 | 3.3 V | 133 MHZ | 0 C~+70 C |