Package | TSOP2 |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 100 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 32M |
Bit Organization | x8 |
Density | 256M |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | low power |
Shipping Method | tray |
Description | Qty | Datecode | |
---|---|---|---|
HY57V56820BLT-P | 10,000 | Get Quote |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V56820AT-P | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |
HY57V56820AT-S | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |
HY57V56820BT-P | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |
HY57V56820T-P | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |
HY57V56820T-S | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |
HY57V56820T-S | TSOP2 | 3.3 V | 100 MHZ | 0 C~+70 C |