Package | TSOP2(86) |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | -40 C~+85 C |
Speed | 143 MHZ |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 2M |
Bit Organization | x32 |
Density | 64M |
Package Material | Lead free |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 5th Gen. |
Power Consumption | super low power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
IS45S32200C1-7TLA1-TR | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
IS45S32200E-7TLA1 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
IS45S32200E-7TLA1-TR | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
IS45S32200L-7TLA1 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
IS45S32200L-7TLA1-TR | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232E-TI70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232E-TI70000 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232E-TP70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232F-TI70 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |
K4S643232F-TI700 | TSOP2(86) | 3.3 V | 143 MHZ | -40 C~+85 C |