| Package | TSOP2(54) |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 125 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Bit Organization | x16 |
| Package Material | normal |
| Hynix Memory | HY |
| Interface | LVTTL |
| Die Generation | 3rd Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| EM638165TS8 | TSOP2(54) | 3.3 V | 125MHZ | 0 C~+70 C |
| HY57V641620BTC-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V641620HCT-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V641620HGLT-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V641620HGT-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V641620HGT-H12288 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V641620HGTH #12288 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V641620HGTP-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V651620ATC-8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |
| HY57V651620B-TC8 | TSOP2(54) | 3.3 V | 125 MHZ | 0 C~+70 C |