HY57V651621BTC-6
Product Details
| Package | TSOP2 |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Bit Organization | x16 |
| Hynix Memory | HY |
| Interface | SSTL_3 |
| Die Generation | 3rd Gen. |
| No Of Banks | 4 banks |
| Power Consumption | normal power |
| Shipping Method | tray |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| HY57V641632DTC-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |
| HY57V641632HGT-6 | TSOP2 | 3.3 V | 166 MHZ | 0 C~+70 C |