Package | TSOP2(86) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 125MHZ |
Std. Pack Qty | |
Std. Carton | |
Bit Organization | x32 |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | low power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
ABS2M32SD-8R | TSOP2(86) | 3.3 V | 125MHZ | 0 C~+70 C |
EM638325TS-8 | TSOP2(86) | 3.3 V | 125MHZ | 0 C~+70 C |
HY57V643220BTC-8 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220BTC6/8 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220CLT-8 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220CT-6 TSOP86 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220CT-686 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220CT-7 #12288 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220CT-8 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |
HY57V643220CT-85 | TSOP2(86) | 3.3 V | 125 MHZ | 0 C~+70 C |