Package | TSOP2(86) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 133 MHZ |
Std. Pack Qty | |
Std. Carton | |
Bit Organization | x32 |
Package Material | normal |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V643220HGT-6,7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220HGT-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220HGT-H | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220HGTP-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220LT-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643220TC-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V643222DTP-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V64322BTC-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V64322CT-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |
HY57V653220ATC-7 | TSOP2(86) | 3.3 V | 133 MHZ | 0 C~+70 C |