Package | TSOP2(86) |
Outpack | TRAY |
RoHS | Leaded |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 100 MHZ |
Std. Pack Qty | |
Std. Carton | |
Bit Organization | x32 |
Interface | LVTTL |
Hynix Memory | HY |
No Of Banks | 4 banks |
Die Generation | 3rd Gen. |
Power Consumption | low power |
Shipping Method | tray |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
HY57V653220CT10P | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
HY57V653220TC-10P | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323AG5-A10-9J | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323AG5-A10-9JH | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323AG5A10-9JD | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323G5-A10 | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323G5-A10-9JH | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323G5-A10-9ZH | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323G5-A10B | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |
UPD4564323G5-A10B-9 | TSOP2(86) | 3.3 V | 100 MHZ | 0 C~+70 C |