| Package | FBGA |
| Outpack | TRAY |
| RoHS | Leaded |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 133MHz, CL3 3-3-3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 8M |
| Bit Organization | x16 |
| Density | 128M |
| Package Material | normal |
| Hynix Memory | HY |
| Die Generation | 5th Gen. |
| Power Consumption | low power |
| Shipping Method | tray |
| Description | Qty | Datecode | |
|---|---|---|---|
| HY5V26DLF-H | 600 | Get Quote | |
| HY5V26DLF-H | 6,000 | Get Quote | |
| HY5V26DLF-H | 12,945 | 06+ | Get Quote |
| HY5V26DLF-H | 15,500 | 06+ | Get Quote |
| HY5V26DLF-H | 6,000 | 05+ | Get Quote |
| HY5V26DLF-H | 1,000 | Get Quote | |
| HY5V26DLF-H | 4,160 | Get Quote | |
| HY5V26DLF-H | 7,580 | Get Quote | |
| HY5V26DLF-H | 6,000 | 2005+ | Get Quote |
| HY5V26DLF-H | 30,000 | 2005+ | Get Quote |