HY5V52ELMP-6
Product Details
| Package | FBGA |
| Outpack | TRAY |
| RoHS | RoHS |
| Voltage | 3.3 V |
| Temperature | 0 C~+70 C |
| Speed | 166MHz, CL3 |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 8M |
| Bit Organization | x32 |
| Density | 256M |
| Package Material | Lead free |
| Hynix Memory | HY |
| Die Generation | 6th Gen. |
| Power Consumption | low power |
| Shipping Method | tray |