HY5V66FFP-H-C

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No	HY5V66FFP-H-C
Brand	SK HYNIX
Item	SDRAM
Part No	4MX16 SD

Product Details

Package	FBGA-60
Outpack	TRAY
RoHS	Leaded
Voltage	3.3 V
Temperature	0 C~+70 C
Speed	133 MHZ
Std. Pack Qty
Std. Carton
Number Of Words	4M
Bit Organization	x16
Density	64M
Package Material	Lead free
Hynix Memory	HY
Die Generation	1st Gen.
Shipping Method	tray

Available Offers

Description	Qty	Datecode
HY5V66FFP-H-C	20,000	2011+	Get Quote
HY5V66FFP-H-C	40,000	2009+	Get Quote
HY5V66FFP-H-C	30		Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description	Package	Voltage	Speed	Temperature
EDS6416AABH-75-E	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
EDS6416AHBH-75	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
EDS6416AHBH-75-E	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
EDS6416AHBH-75IT-E	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
EDS6416AHBH-75L-E	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
EDS6416CHBH-75-E	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
HY5V66DLF-H	FBGA-60	3.3 V	133 MHZ	0 C~+70 C
HY5V66GF-H	FBGA-60	3.3 V	133 MHZ	0 C~+70 C