K4B2G0846D-HYH9 IC

Product Overview

IC Picture

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Manufacturer Part No K4B2G0846D-HYH9 IC
Brand SAMSUNG
Item DDR3L SDRAM
Part No 256MX8 DDR3L

Product Details

Package FBGA-78
Outpack
RoHS RoHS
Voltage 1.35 V
Temperature 0 C~+85 C
Speed 1333 MBPS
Std. Pack Qty
Std. Carton
Number Of Words 256M
Bit Organization x8
Density 2G
Internal Banks 8 Banks
Power Low VDD(1.35V)
Generation 5th Generation

Available Offers

Description Qty Datecode
K4B2G0846D-HYH9 IC 1,341 1237+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
H5TC2G83BFR-H9A FBGA-78 1.35V 1333 MBPS 0 C~+85 C
H5TC2G83CFR-H9A FBGA-78 1.35V 1333 MBPS 0 C~+85 C
H5TC2G83DFR-H9C FBGA-78 1.35V 1333 MBPS 0 C~+85 C
H5TC2G83EFR-H9A FBGA-78 1.35V 1333 MBPS 0 C~+85 C
H5TC2G83EFR-H9C FBGA-78 1.35V 1333 MBPS 0 C~+85 C
H5TC2G83FFR-H9A FBGA-78 1.35V 1333 MBPS 0 C~+85 C
H5TC2G83FFR-H9AR FBGA-78 1.35V 1333 MBPS 0 C~+85 C
IS43TR82560AL-15HBL FBGA-78 1.35 V 1333 MBPS 0 C~+85 C
IS43TR82560AL-15HBL-TR FBGA-78 1.35 V 1333 MBPS 0 C~+85 C
IS43TR82560BL-15HB FBGA-78 1.35 V 1333 MBPS 0 C~+85 C