K4H560438EGCBO
Product Overview
Images are for reference only
| Manufacturer Part No | K4H560438EGCBO |
| Brand | SAMSUNG |
| Item | DDR1 SDRAM |
| Part No | 64MX4 DDR1 |
Product Details
| Package | FBGA |
| Outpack | |
| RoHS | Leaded |
| Voltage | 2.5 V |
| Temperature | 0 C~+85 C |
| Speed | 166 MHZ |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 64M |
| Bit Organization | x4 |
| Density | 256M |
| Internal Banks | 4 Banks |
| Power | Normal Power |
| Generation | 6th Generation |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| K4H560438D-GCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438DGLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-GCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-VCB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438E-VLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438EGCB30 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438EGLB3 | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |
| K4H560438N-LCB3TCV | FBGA | 2.5 V | 166 MHZ | 0 C~+85 C |