K4H561638F-GCB3

Product Overview

IC Picture

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Manufacturer Part No K4H561638F-GCB3
Brand SAMSUNG
Item DDR1 SDRAM
Part No 16MX16 DDR1
Alternate Names K4H561638F-GCB3T00
K4H561638FGCB3000

Product Details

Package FBGA
Outpack
RoHS Leaded
Voltage 2.5 V
Temperature 0 C~+85 C
Speed 166 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 16M
Bit Organization x16
Density 256M
Internal Banks 4 Banks
Power Normal Power
Generation 7th Generation

Available Offers

Description Qty Datecode
K4H561638F-GCB3 4,000 Get Quote
K4H561638FGCB3000 800 4 Get Quote
K4H561638F-GCB3 3,120 2009+ Get Quote
K4H561638F-GCB3 15,005 2006+ Get Quote
K4H561638F-GCB3 8,835 2009+ Get Quote
K4H561638F-GCB3 2,000 Get Quote
K4H561638F-GCB3 2,000 2004+ Get Quote
K4H561638F-GCB3 8,862 09+ Get Quote
K4H561638FGCB3000 800 04+ Get Quote
K4H561638FGCB3000 12,000 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
IS43R16160D-6B FBGA 2.5 V 166 MHZ 0 C~+85 C
IS43R16160F-6B FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638A-GCB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638A-GLB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638B-GCB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638B-GLB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638C-GCB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638C-GLB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638D-GCB3 FBGA 2.5 V 166 MHZ 0 C~+85 C
K4H561638D-GCB3000 FBGA 2.5 V 166 MHZ 0 C~+85 C