K4M56163PG-BG1L

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4M56163PG-BG1L
Brand SAMSUNG
Item SDRAM MOBILE
Part No 16MX16 SD

Product Details

Package FBGA
Outpack
RoHS RoHS
Voltage 1.8 V
Temperature -25 C~+70 C
Speed 105MHZ
Std. Pack Qty
Std. Carton
Number Of Words 16M
Bit Organization x16
Density 256M
Internal Banks 4 Banks
Power Low, i-TCSR & PASR & DS
Generation 8th Generation

Available Offers

Description Qty Datecode
K4M56163PG-BG1L 4,000 Get Quote
K4M56163PG-BG1L 2,586 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4M56163PE-BG1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PE-RG1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PF-BG1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PG-BC1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PG-BE1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PG-BF1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PG-RE1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PG-RF1L FBGA 1.8 V 105MHZ -25 C~+70 C
K4M56163PG-RG1L FBGA 1.8 V 105MHZ -25 C~+70 C