K4M56163PIHG75

Product Overview

IC Picture

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Manufacturer Part No K4M56163PIHG75
Brand SAMSUNG
Item SDRAM MOBILE
Part No 16MX16 SD

Product Details

Package FBGA
Outpack
RoHS Leaded
Voltage 1.8 V
Temperature -25 C~+85 C
Speed 133MHZ
Std. Pack Qty
Std. Carton
Number Of Words 16M
Bit Organization x16
Density 256M
Internal Banks 4 Banks
Generation 10th Generation
Power Low, i-TCSR & PASR & DS

Available Offers

Description Qty Datecode
K4M56163PIHG75 4,000 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4M56163PC-BG75 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PE-BG75 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PF-BG75 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BE75 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BG75 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BG750 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BG7500 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BG75000 FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BG75000SAMSUNG FBGA 1.8 V 133 MHZ -25 C~+85 C
K4M56163PG-BG750JR FBGA 1.8 V 133 MHZ -25 C~+85 C