K4S28323LF-HL1L

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4S28323LF-HL1L
Brand SAMSUNG
Item SDRAM MOBILE
Part No 4MX32 SD

Product Details

Package FBGA
Outpack
RoHS Leaded
Voltage 3.3 V
Temperature -25 C~+70 C
Speed 100 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 4M
Bit Organization x32
Density 128M
Internal Banks 4 Banks
Power Low Power
Generation 7th Generation

Available Offers

Description Qty Datecode
K4S28323LF-HL1L 1,954 2007+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4S28323LF-FC1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-FE1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-FL1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-FN1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-FR1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-FS1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-HC1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-HE1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-HN1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S28323LF-HR1L FBGA 3.3 V 100 MHZ -25 C~+70 C