K4S563233F-FF75

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No K4S563233F-FF75
Brand SAMSUNG
Item SDRAM
Part No 8MX32 SD

Product Details

Package FBGA
Outpack
RoHS Leaded
Voltage 3.3 V
Temperature 0 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 8M
Bit Organization x32
Density 256M
Internal Banks 4 Banks
Power Low, i-TCSR & PASR & DS
Generation 7th Generation

Available Offers

Description Qty Datecode
K4S563233F-FF75 2,541 2007+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4S563233F-FC75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S563233F-FL75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S563233F-HC75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S563233F-HCLF75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S563233F-HF75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S563233F-HL75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S563233FHL750 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S56323LF-FC75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S56323LF-FL75 FBGA 3.3 V 133 MHZ 0 C~+85 C
K4S56323LF-HC75 FBGA 3.3 V 133 MHZ 0 C~+85 C