K4S56323LF-HC1L

Product Overview

IC Picture

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Manufacturer Part No K4S56323LF-HC1L
Brand SAMSUNG
Item SDRAM
Part No 8MX32 SD

Product Details

Package FBGA
Outpack
RoHS Leaded
Voltage 3.3 V
Temperature -25 C~+70 C
Speed 100 MHZ
Std. Pack Qty
Std. Carton
Number Of Words 8M
Bit Organization x32
Density 256M
Internal Banks 4 Banks
Power Normal Power
Generation 7th Generation

Available Offers

Description Qty Datecode
K4S56323LF-HC1L 2,541 2007+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K4S563233F-FC1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-FE1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-FF1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-FG1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-FL1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-FN1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-HC1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-HE1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-HF1L FBGA 3.3 V 100 MHZ -25 C~+70 C
K4S563233F-HG1L FBGA 3.3 V 100 MHZ -25 C~+70 C