K9F5608B(U)OC-YCB0

Product Overview

IC Picture

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Manufacturer Part No K9F5608B(U)OC-YCB0
Brand SAMSUNG
Item FLASH-NAND
Part No 32MX8 NAND SLC

Product Details

Package TSOP
Outpack TRAY
RoHS Leaded
Voltage 2.5V ~ 2.9
Temperature 0 C~+70 C
Speed 50 NS
Std. Pack Qty 960
Std. Carton
Number Of Words 32M
Bit Organization x8
Density 256M
Pre Prog Version Serial
Classification SLC Normal

GENERAL DESCRIPTION Offered in 32Mx8bit , the K9F5608X0D is 256M bit with spare 8capacity. The device is offered in 1.8V, 2.7V, 3.3tsVcc. I NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be performed in typical 200µs on a 528-byte page and an erase operation can be performed in typical 2ms on a 16K-byte block. Data in the page can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as comm and input. The on-chip write control automates all program and er ase functions including pulse repetition, where required, and in ternal verification and margining of data. Even the write-intensive systems can take advantage of the K9F5608X0D′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F5608X0D is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
K9F56080B/A-YCB0 TSOP 2.65V 50 NS 0 C~+70 C
K9F56080U0B-YCB0 TSOP 2.7V-3.6V 50 NS 0 C~+70 C
K9F560840C-YCB000 TSOP 2.65V 50 NS 0 C~+70 C
K9F5608B0A-YCB0 TSOP 2.5V ~ 2.9 50 NS 0 C~+70 C
K9F5608DOC-YCBO TSOP 2.65V 50 NS 0 C~+70 C
K9F5608DOD-YCBO TSOP 2.65V 50 NS 0 C~+70 C
K9F5608U0-YCB0 TSOP 2.7V-3.6V 50 NS 0 C~+70 C
K9F5608U07YCB0 TSOP 2.7V-3.6V 50 NS 0 C~+70 C
K9F5608U08-YCB0 TSOP 2.7V-3.6V 50 NS 0 C~+70 C
K9F5608U08-YCB0T00 TSOP 2.7V-3.6V 50 NS 0 C~+70 C