Images are for reference only
Manufacturer Part No | MT29F32G08CBABBWP-12:B |
Brand | MICRON |
Item | FLASH-NAND |
Part No | 4GX8 NAND MLC |
Package | TSOP-48 |
Outpack | |
RoHS | RoHS |
Voltage | 3.3 V |
Temperature | 0 C~+70 C |
Speed | 166 MT/S |
Std. Pack Qty | |
Std. Carton | |
Number Of Words | 4G |
Bit Organization | x8 |
Density | 32G |
Production Status | Production |
Package Material | Pb-free |
Interface | Sync/Async |
Level | MLC-2 |
Generation Feature Set | 2nd set of device features (rev only if different than 1st set) |
Speed Grade | 166 MT/s |
Design Revision | B |
Package | TSOP I(48-pin CPL version) |
Classification | 1-1-1-1 (Die-nCE-RnB-IO Channels) |
General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (DQx) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection (WP#) and monitor device status (R/B#). This Micron NAND Flash device additionally includes a synchronous data interface for high-performance I/O operations. When the synchronous interface is active, WE# becomes CLK and RE# becomes W/R#. Data transfers include a bidirectional data strobe (DQS). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). For further details, see Device and Array Organization.
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
MT29F32G08CBABBWP-12 | TSOP-48 | 3.3 V | 166 MT/S | 0 C~+70 C |
MT29F32G08CBADBWP-12:D | TSOP-48 | 3.3 V | 166 MT/S | 0 C~+70 C |
MT29F32G08CBADBWP-12D | TSOP-48 | 3.3 V | 166 MT/S | 0 C~+70 C |
MT29F32G08CFACBWP-12 | TSOP-48 | 3.3 V | 166 MT/S | 0 C~+70 C |
MT29F32G08CFACBWP-12:C | TSOP-48 | 3.3 V | 166 MT/S | 0 C~+70 C |
MT29F32G08CFACBWP-12C | TSOP-48 | 3.3 V | 166 MT/S | 0 C~+70 C |