Package | T-PBGA-24 |
Outpack | TRAY |
RoHS | RoHS |
Voltage | 1.8 V |
Temperature | -40 C~+85 C |
Speed | 108 MHZ |
Std. Pack Qty | |
Std. Carton | |
Density | 128M |
Security | 0 |
Feature Set | Byte addressability, hold pin, Micron XiP |
Array Configuration | Uniform |
Packaging | Tray |
Package | SOP2-8/208 mil(SO8W) |
Lithography | 65nm |
Description | Package | Voltage | Speed | Temperature |
---|---|---|---|---|
N25Q128A13ESFH0E | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A13EV740 | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A13XSF40F | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A21BSF40 | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A23B1241E | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A23B1241F | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A23XSF40F | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |
N25Q128A31EF740F | T-PBGA-24 | 1.8 V | 108 MHZ | -40 C~+85 C |