TC58NYG0S3EBAI4LR0
Product Overview
Images are for reference only
| Manufacturer Part No | TC58NYG0S3EBAI4LR0 |
| Brand | KIOXIA |
| Item | FLASH-NAND |
| Part No | 128MX8 NAND SLC |
Product Details
| Package | BGA-63 |
| Outpack | |
| RoHS | RoHS |
| Voltage | 1.8 V |
| Temperature | -40 C~+85 C |
| Speed | 25 NS |
| Std. Pack Qty | |
| Std. Carton | |
| Number Of Words | 16M |
| Bit Organization | x8 |
| Density | 128M |
| Mono Stack | Single Chip |
| Nand Type | NAND |
| Cell Level | 2 Level( 1 bits/cell ) |
| Page Size | 2KB |
| Design Rule | 43 nm |
| Package Size | TSOP[mm]: Reserved, LGA[mm]: 40 lands, 12 x 17 x 1.0, BGA[mm]: 60 balls, 9 x 11 |
| Additional Code | LR0 |
| Package Material | Lead-Free: Yes, Halogen-Free: Yes |
| Channel | Single, # of CE 1 |
| Block Size | 128KB |
Available Offers
| Description | Qty | Datecode | |
|---|---|---|---|
| TC58NYG0S3EBAI4LR0 | 5,000 | Get Quote |
FFFE (Form, Fit & Functional Equivalents)
| Description | Package | Voltage | Speed | Temperature |
|---|---|---|---|---|
| H27S1G8F2BFR-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2BFR-BI NBSP | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2BFR-BIR | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2CFE-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| H27S1G8F2CFR-BI | FBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| IS35MW01G084-BLA1 | VFBGA-63 | 1.8 V | 25 NS | -40 C~+85 C |
| K9F1G08R08-JIBO | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A-/B-JIB | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A-JIB0000 | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |
| K9F1G08R0A/B-JIB0 | FBGA-63 | 1.65V~1.95V | 25 NS | -40 C~+85 C |