TH58NVG3S0HBAI4BD0

Product Overview

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Manufacturer Part No TH58NVG3S0HBAI4BD0
Brand KIOXIA
Item FLASH-NAND
Part No 1GX8 NAND SLC

Product Details

Package BGA-63
Outpack TRAY
RoHS RoHS
Voltage 3.3 V
Temperature -40 C~+85 C
Speed 25 NS
Std. Pack Qty 1050
Std. Carton
Number Of Words 128M
Bit Organization x8
Density 1G
Mono Stack Multi Chip
Nand Type NAND
Cell Level 2 Level( 1 bits/cell )
Page Size 4KB
Design Rule 24nm B-type
Package Size TSOP[mm]: Reserved, LGA[mm]: 40 lands, 12 x 17 x 1.0, BGA[mm]: 60 balls, 9 x 11
Additional Code BD0
Package Material Lead-Free: Yes, Halogen-Free: Yes
Channel Single, # of CE 1
Block Size 256KB

Available Offers

Description Qty Datecode
TH58NVG3S0HBAI4BD0 1,050 21+ Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
IS34ML08G088-BLI VFBGA-63 3.3 V 25 NS -40 C~+85 C
K9F8G08UOAJIBO FBGA-63 2.7V~3.6V 25 NS -40 C~+85 C
S34ML08G101BHA000 BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G101BHI00 BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G101BHI000 BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G101BHI003 BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G101BHI003 63-BGA BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G101BHI003-63. BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G201BHA0 BGA-63 3.3 V 25 NS -40 C~+85 C
S34ML08G201BHA003 BGA-63 3.3 V 25 NS -40 C~+85 C