TH58NYG3S0HBAI4JDH

Product Overview

IC Picture

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Manufacturer Part No TH58NYG3S0HBAI4JDH
Brand KIOXIA
Item FLASH-NAND
Part No 1GX8 NAND SLC

Product Details

Package BGA-63
Outpack
RoHS RoHS
Voltage 1.8 V
Temperature -40 C~+85 C
Speed 25 NS
Std. Pack Qty
Std. Carton
Number Of Words 128M
Bit Organization x8
Density 1G
Mono Stack Multi Chip
Nand Type NAND
Cell Level 2 Level( 1 bits/cell )
Page Size 4KB
Design Rule 24nm B-type
Package Size TSOP[mm]: Reserved, LGA[mm]: 40 lands, 12 x 17 x 1.0, BGA[mm]: 60 balls, 9 x 11
Additional Code JDH
Package Material Lead-Free: Yes, Halogen-Free: Yes
Channel Single, # of CE 1
Block Size 256KB

Available Offers

Description Qty Datecode
TH58NYG3S0HBAI4JDH 160 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
TC58NYG3S0FBAIDLDH BGA-63 1.8 V 25 NS -40 C~+85 C
TH58BYG3S0HBAI4 TRAY BGA-63 1.8 V 25 NS -40 C~+85 C
TH58NYG3S0HBAI4 BGA-63 1.8 V 25 NS -40 C~+85 C
TH58NYG3S0HBAI4 TRAY BGA-63 1.8 V 25 NS -40 C~+85 C