W25Q256FVCIG

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No W25Q256FVCIG
Brand WINBOND
Item FLASH-QSPI-NOR
Part No 256MB SPI

Product Details

Package TFBGA-24
Outpack
RoHS RoHS
Voltage 2.7V-3.6V
Temperature -40 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Density 256M
Product Family SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O
Product Number Density 256 Mbit
Special Options green package (Lead-free, RoHS compliant, Halogen-free(TBBA), Antimony-Oxide-free S2bO3)
Company Prefix winbond

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
IS25LP256D-JGLA1 TFBGA-24 2.3V-3.6V 133 MHZ -40 C~+85 C
IS25LP256D-JHLA1 TFBGA-24 2.3V-3.6V 133 MHZ -40 C~+85 C
MT25QL256ABA8E12-1SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL256ABA8E121SI-TTR T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MT25QL256ABA8E14-1SIT T-PBGA-24 2.7V~3.6V 133 MHZ -40 C~+85 C
MX25L25645GXDI-08G TFBGA-24 3.3 V 133 MHZ -40 C~+85 C
MX25L25645GXDI-08GT/R TFBGA-24 3.3 V 133 MHZ -40 C~+85 C
S25FL256LAGBHI020 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL256LAGBHI023 BGA-24 3.0 V 133 MHZ -40 C~+85 C
S25FL256SAGBHAC00 BGA-24 3.0 V 133 MHZ -40 C~+85 C