W25Q64FVSSIP

Product Overview

IC Picture

Images are for reference only

Manufacturer Part No W25Q64FVSSIP
Brand WINBOND
Item FLASH-QSPI-NOR
Part No 64MB SPI

Product Details

Package SOIC-8
Outpack
RoHS RoHS
Voltage 2.7V-3.6V
Temperature -40 C~+85 C
Speed 133 MHZ
Std. Pack Qty
Std. Carton
Density 64M
Product Family SpiFlash serial flash memory with 4 KB sectors, Dual/Quad I/O
Company Prefix winbond
Product Number Density 64 Mbit
Special Options green package with status register power-down & OTP enabled

Available Offers

Description Qty Datecode
W25Q64FVSSIP 3,937 16+ Get Quote
W25Q64FVSSIP 3,937 Get Quote
W25Q64FVSSIP 15,000 2016 Get Quote

FFFE (Form, Fit & Functional Equivalents)

Description Package Voltage Speed Temperature
IS25LP064A-JBLA1 SOIC-8 2.3V-3.6V 133 MHZ -40 C~+85 C
IS25LP064A-JBLE-TR SOIC-8 SOIC-8 2.3V-3.6V 133 MHZ -40 C~+85 C
IS25LP064A-JFLA1 VSOP-8 2.3V-3.6V 133 MHZ -40 C~+85 C
MX25L6408EM2I-12G SOP-8 3.3 V 133 MHZ -40 C~+85 C
MX25L6433FM2I-08G SOP-8 3.3 V 133 MHZ -40 C~+85 C
MX25L6433FM2I-08G(REEL) SOP-8 3.3 V 133 MHZ -40 C~+85 C
MX25L6433FM2I-08G(TAPE REEL) SOP-8 3.3 V 133 MHZ -40 C~+85 C
MX25L6433FM2I-08G,IF150-1333-0 SOP-8 3.3 V 133 MHZ -40 C~+85 C
MX25L6433FM2I-08G,IF150-1334-0 SOP-8 3.3 V 133 MHZ -40 C~+85 C
MX25L6433FM2I-08G,IFJVPRG10537 SOP-8 3.3 V 133 MHZ -40 C~+85 C